Advanced Packaging & Integration Lead
We are seeking an experienced Advanced Packaging & Integration Lead to join our team and develop packaging solutions for multi-chip silicon spin-qubit devices within a scalable quantum system.
In this role, you will work with a multidisciplinary team to drive the R&D of complex multi-chip modules utilising TSVs and micro-bumps, optimised for operation at millikelvin temperatures. You will have a significant influence on the physical architecture of next-generation quantum processors, shaping how advanced packaging subsystems integrate into the overall quantum computing solution.
Main Duties and Responsibilities
Drive the high-level strategy and architectural design of 3D integrated circuits and multi-chip quantum modules.
Develop advanced packaging solutions using TSVs, fine-pitch micro-bumps, and flip-chip bonding.
Ensure packaging architectures and interconnects can withstand thermal cycling down to the millikelvin regime without delamination or loss of reliability.
Contribute to early-stage architecture and co-design activities, ensuring the advanced packaging subsystem scales with the requirements of the overall quantum system.
Develop simulation
