Lead Expert – Hybrid Bonding, CMP & Advanced Packaging Metrology
About Nearfield Instruments
Nearfield Instruments (NFI) is a fast-growing, high-tech scale-up. We design, develop, integrate, market, and service advanced metrology machines. Our solutions enable the world’s leading chipmakers to increase production yield and improve device performance—powering smaller, faster, and more energy-efficient electronics.
Nearfield brings together leading experts in science and engineering to develop a unique, high-throughput Scanning Probe Microscopy (SPM) platform delivering true 3D, sub-nanometer resolution metrology at production scale.
We are looking for a senior semiconductor expert with deep experience in hybrid bonding, chemical mechanical planarization (CMP), and advanced packaging, gained within a leading-edge fab, research institute, or semiconductor equipment company.
This expert will lead Nearfield Instruments’ application and technology direction for CMP, hybrid bonding, wafer-to-wafer and die-to-wafer integration, and advanced packaging. The role will identify the most critical process-control challenges, translate them into clear metrology requirements, and drive the development of new applications, capabilities, and product features that create greater value for customers.
Key responsibilities include:
