Senior Hardware Engineer - QPU Packaging

At OQC, we aren’t just theorising about the future; we’re building it. Born from a philosophy of bold innovation, we’ve successfully transitioned quantum computing from an academic dream into a commercial reality. The most exciting thing is that we’re just getting started and we’ve recently closed our £260 million Series C funding round – the largest fundraise ever completed by a quantum computing company in Europe.

The Purpose

As a Senior Hardware Engineer within our QPU Packaging team, you’ll own the thermal simulation and optimisation of the cryogenic hardware surrounding our quantum processors. Your work will help us understand, predict and engineer how complex materials and interfaces behave at millikelvin temperatures – directly enabling the next generation of OQC’s quantum computing technology.

This is a senior R&D role with real technical ownership. You’ll turn simulation, experimental data and deep engineering insight into the design rules and technologies that allow us to scale our QPU packaging for future systems.

The Role

You’ll sit at the intersection of thermal, mechanical, materials and quantum engineering, working closely with Mechanical Design Engineers, Material Scientists, nanofabrication specialists, Cryogenic specialists and Quantum Test Engineers.

Your primary focus will be thermal simulation and optimisation. You’ll model how materials, components and interfaces behave as they move into the cryogenic reg