System & Advanced Packaging Design Lead

Role Overview

We are seeking an Advanced 2.5D/3D/Chiplet packaging Lead, who will be directing Signal Integrity for Package, PCB and System design for Copper Interconnects beyond 200G, Work on enabling advanced packaging for Driver, TIA & Optics for AI Scale up engine including SI/ PI, Reliability, Thermals and HVM; Also drive Micro-LED packaging and Heterogeneous package development. Good understanding of OSAT ecosystem and drive the development of complete solutions for data-centers

Key Responsibilities

Technical Leadership & Execution

• Own package, PCB, and system-level signal integrity architecture for 200G+/lane copper interconnects (C2M, C2C, and cable assemblies) — from channel budgeting and topology definition through post-layout signoff and correlation with silicon measurements.
• Drive 2.5D/3D and heterogeneous package development for co-packaged driver, TIA, and optical engines, including substrate architecture, interposer/bridge evaluation, and die–package co-design with the SerDes and analog design teams.
• Lead micro-LED and photonic packaging development: optical coupling and alignment strategy, hermeticity and reliability, and thermal co-design with the optical engine.
• Define and manage the OSAT and substra