Photonic Packaging Engineer
About Quandela
Quandela is a global leader in photonic quantum computing, developing hardware and software technologies to build scalable and energy-efficient quantum systems.
With more than 140 people, we develop our own stack, from semiconductor quantum emitters and photonic integrated circuits to quantum control systems, software and algorithms.
Our ambition is to build large-scale fault-tolerant quantum computers. Reaching this scale requires increasingly reliable, manufacturable and integrated photonic hardware, making our Integrated Photonics team a key part of this journey.
About this position:
You will join our Integrated Photonics team, working across Massy and Palaiseau at the interface between PIC design, characterization, packaging and system integration.
We are looking for a hands-on Photonic Packaging Engineer to take ownership of our packaging activities, improve existing processes and help make our PIC integration more reliable and reproducible.
Your first priority will be to contribute to ongoing packaging activities, develop and improve assembly processes, and troubleshoot integration challenges alongside our PIC design and characterization teams.
As you grow into the role, you will also have the opportunity to develop new packaging approaches, coordinate technical projects and contribute to building more structured and scalable packaging capabilities.
