3D Packaging Engineer
About Us
QuantWare is building the world’s most powerful quantum processors to solve humanity's greatest challenges. We do this with our unique VIO™ technology, the only QPU architecture that breaks the hardware barriers that have held quantum computing back, unlocking the path to MegaQubit quantum processors.
With VIO, we are paving the way for the hyper-scale quantum computers that will change the world. And delivering on that vision demands people who don’t shy away from tackling the hardest challenges of our time. That’s where you come in!
As a 3D Packaging Engineer, you will collaborate closely with our engineering team to physically realize our VIO products. You will operate, adapt, and fine-tune high-precision assembly equipment to meet the precise tolerances required for optimal device performance.
What You'll Be Doing
Tooling Adaptation: Assist in modifying and calibrating high-precision assembly equipment (e.g., flip-chip bonders, die attach machines) to meet unique quantum 3D integration specifications.
Process Optimization: Help develop and refine placement and bonding processes (t
