Advanced Package Design Engineer
About SK hynix America:
At SK hynix America, we are at the forefront of semiconductor innovation. As a global leader in HBM, DRAM, and NAND flash technologies, we develop the advanced memory solutions powering everything from advanced mobile technology to massive AI data centers. With major investments in the U.S. and a leading position in the global AI revolution, we build the critical infrastructure of the digital landscape and remain committed to sustainable operations. We invite innovative minds to be part of our journey. Here, you will be part of a collaborative team pioneering the next generation of memory technologies, expanding our market footprint, and defining the future of computing.
Work Model: Onsite
Job Summary:
We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solutions. You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions
Responsibilities:
