Head of Device Fabrication, Advanced Packaging and Assembly

At Universal Quantum, we are building the next generation of quantum computers - machines capable of solving problems once thought impossible. Our technology has the potential to transform industries from healthcare to aerospace, materials science, and beyond. As we scale from breakthrough R&D to global delivery, resilient execution becomes as critical as technical innovation.

The Head of Device Fabrication, Advanced Packaging and Assembly is accountable for the development, industrialisation, and delivery of foundry processes, advanced packaging, and assembly technologies for quantum processors.

Based in Singapore, the role leads a global organisation across Singapore and Japan and manages strategic relationships with semiconductor foundries, outsourced semiconductor assembly and test providers, and specialist package and materials suppliers. The position combines deep technical leadership, external partner management, organisational development, and programme delivery. It owns the research and development roadmap from early process concepts through qualified, repeatable manufacturing solutions, ensuring close alignment with Systems Engineering, Device Design, Product, and Architecture teams.

What You'll Accomplish

• Technology strategy and leadership: Define and deliver the roadmap, standards, and investment priorities for quantum processor fabrication, packaging, assembly, and test.
• Glob