Packaging Engineer- Materials

We’re looking for a hands-on process and materials engineer to own wafer level molding and underfill processes, material qualification, and assembly integration across development and manufacturing.

 

Summary:

Seeking an experienced engineer to lead wafer level mold and underfill process development for advanced semiconductor packages (fan-out wafer level packaging, 2.5D/3D, chiplet). This role spans

mold compound and underfill material selection and qualification, wafer level molding and encapsulation processes, underfill dispense and cure, reliability, failure analysis, and cross-functional support through package and system productization.

 

Core Responsibilities:

• Develop and optimize wafer level molding processes including compression molding, transfer

molding, and mold underfill (MUF) for fan-out and advanced heterogeneous packages.

• Own mold compound and underfill material selection and qualification, including evaluation of

filler content, CTE, modulus, Tg, viscosity, and moisture uptake to meet thermo-mechanical and

reliability requirements.

• Drive underfill process development including capillary unde